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LG 32LV3700 TV Driver

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LG 32LV3700 TV Driver

Use this technique only on IC connections. Carefully remove the damaged copper pattern with a sharp knife.

Remove only as much copper as absolutely necessary. Bend a small "U" in one end of a small gauge jumper wire and LG 32LV3700 TV crimp LG 32LV3700 TV around the IC pin. Solder the IC connection. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

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Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves LG 32LV3700 TV installation of a jumper wire on the component side of the circuit board. Remove the defective copper pattern with a sharp knife.

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After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

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Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. Most replacement ES devices are packaged with leads LG 32LV3700 TV shorted together by conductive foam, aluminum LG 32LV3700 TV or comparable conductive material.

Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. Be sure no power is applied to the chassis or circuit, and observe LG 32LV3700 TV other safety precautions.

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Minimize bodily motions when handling unpackaged replacement ES devices. General Soldering Guidelines 1.

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Keep the soldering iron tip clean and well tinned. Thoroughly clean the surfaces to be soldered. Use a mall wire- bristle 0.

Do not use freon-propelled spray-on cleaners. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. Heat the component lead until the solder melts.

Quickly LG 32LV3700 TV the melted solder with an anti-static, suction- type solder removal device or with solder braid. Work quickly to avoid overheating the circuit board printed foil. Use the following soldering technique.

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